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QUICK EA-A10 Hot Air BGA Rework System

EA-A10 Hot Air BGA Rework System

The EA-A10 Hot Air BGA Rework System from QUICK is engineered for precision electronics assembly and rework. It is available in China from ELINK (Shanghai) Ltd, the authorised QUICK distributor, with local stock, selection advice and after-sales support.

Key Features

  • One-key desoldering and placement
  • Zero-pressure chip placement
  • Electric joystick motion control
  • Dedicated software interface
EA-A10 Hot Air BGA Rework System
EA-A10 Hot Air BGA Rework System
EA-A10 Hot Air BGA Rework System
EA-A10 Hot Air BGA Rework System
EA-A10 Hot Air BGA Rework System
EA-A10 Hot Air BGA Rework System
EA-A10 Hot Air BGA Rework System
EA-A10 Hot Air BGA Rework System
EA-A10 Hot Air BGA Rework System
EA-A10 Hot Air BGA Rework System

Specifications

ModelEA-A10EA-A20
Total power4200W(Max)6600W(Max)
Power supply220V AC 50Hz220V AC 50Hz
Hot air heating temperature400℃(Max)400℃(Max)
Bottom preheating temperature400℃(Max)400℃(Max)
Top hot air heating power1200W1200W
Bottom hot air heating power1200W1200W
Bottom infrared preheating power1600W4000W
Hot air flow60L/S60L/S
Bottom radiant preheating size310*260mm530*405mm
Max PCB size420mm*450mm600mm*650mm
Chip size range2*2mm~60*60mm2*2mm~60*60mm
Adjustable side cooling fan speed≤3.5m3/min≤3.5m3/min
CommunicationUSBUSB

Product information compiled from the official QUICK catalogue. ELINK (Shanghai) Ltd is the authorised QUICK distributor in China, providing selection advice, local stock and after-sales support.