QUICK R35 Infrared BGA Rework System
The R35 Infrared BGA Rework System from QUICK is engineered for precision electronics assembly and rework. It is available in China from ELINK (Shanghai) Ltd, the authorised QUICK distributor, with local stock, selection advice and after-sales support.
Key Features
- Infrared plus hot air hybrid three-zone heating system
- Non-contact infrared sensor detects chip temperature
- True closed-loop temperature control
- One-key operation
Specifications
| Model | QUICK EA-R35 |
|---|---|
| Peak power | 13.5KW |
| Power supply | AC380V±10% 50/60Hz |
| Top infrared heating power | 1.2KW |
| Local hot air heating power | 1.2KW |
| Bottom infrared preheating power | 9.6KW |
| PCB range | 10*10 - 700*650mm |
| Preheating area | 820*570mm |
| Chip range | 5*5- 65*65mm |
| Placement pressure | 0/1.5N |
| Placement accuracy | ±0.025mm |
| Temperature control accuracy | ±2℃ |
| Weight | 560Kg |
Product information compiled from the official QUICK catalogue. ELINK (Shanghai) Ltd is the authorised QUICK distributor in China, providing selection advice, local stock and after-sales support.